Responsibility:
• FAB support of design in terms of Design for manufacturability requirements.
• Advance Si node technology adopting and implementation
• New product characterization management and analysis together with test engineering team.
• Full responsibility of new Tapeout tasks
• Responsibility for qualification activities, both product and foundry process level
• FAB transfers management
• FAB, Assembly, and Design related product yield enhancement activities including yield monitor
• Technical operation support that cover production events handling and hold dispositions
Requirements:
• B.Sc. in Electrical Engineering with at least 5 years of applicable industrial experience
• IC and Semiconductor manufacturing background with emphasis on mass production
• Knowledge and experience in statistical including statistic programs
• Fluent English (written and verbal)
• Able to work under pressure in dynamic environment
• Travel to the Far East will be required.